Keynote Speaker

FPODr. Robert Weigel, Professor, Friedrich-Alexander-University of Erlangen-Nuremberg, Germany.

Bio: Robert Weigel was born in Ebermannstadt, Germany, in 1956. He received the Dr.-Ing. and the Dr.-Ing.habil. degrees, both in electrical engineering and computer science, from the Munich University of Technology in Germany, in 1989 and 1992, respectively. From 1982 to 1988, he was a Research Engineer, from 1988 to 1994 a Senior Research Engineer, and from 1994 to 1996 a Professor for RF Circuits and Systems at the Munich University of Technology. In winter 1994/95 he was a Guest Professor for SAW Technology at Vienna University of Technology in Austria. From 1996 to 2002, he has been Director of the Institute for Communications and Information Engineering at the University of Linz, Austria. In August 1999, he co-founded DICE - Danube Integrated Circuit Engineering, Linz, meanwhile an Infineon Technologies Design Center (DICE) and an Intel company (DMCE) which are devoted to the design of, respectively, industrial electronics and mobile radio electronics. In 2000, he has been appointed a Professor for RF Engineering at the Tongji University in Shanghai, China. Also in 2000, he co-founded the Linz Center of Competence in Mechatronics, meanwhile also a company. Since 2002 he is head of the Institute for Electronics Engineering at the University of Erlangen-Nuremberg, Germany. In 2009 and 2012, respectively, he co-founded eesy-id in Erlangen and eesy-ic in Nuremberg, both dealing with electronics engineering.

He has been engaged in research and development on microwave theory and techniques, integrated optics, high-temperature superconductivity, SAW technology, digital and microwave communication systems, automotive EMC. In these fields, he has published more than 700 papers and given about 300 international presentations. His review work includes European and Asian research projects and international journals. In 2002, he received the German ITG Award, and in 2007 the IEEE Microwave Applications Award.

Dr. Weigel is a Fellow of IEEE, a member of the The Electromagnetics Academy, and a member of the German VDE and the Austrian OVE. He serves on several editorial boards such as the Proceedings of the IEEE and advisory boards of companies and research institutes. He is the elected speaker of the Electrical Engineering Faculty of the German Research Foundation (DFG) and an elected member of the German National Academy of Science and Engineering (acatech). Within IEEE MTT-S, he has been Founder and Chair of the Austrian COM/MTT Joint Chapter, Region 8 Coordinator and, during 2001 to 2003 Distinguished Microwave Lecturer. He is an AdCom Member and Chair of MTT-2 Microwave Acoustics. Dr. Weigel is the General Chairman of the 2013 European Microwave Week in Nuremberg, Germany

Title: Design and Simulation of Advanced Packaging Platforms for High Volume RF System Applications

Abstract: The level of integration for RF and millimeterwave systems towards low-cost, advanced system-in-package (SIP) solutions is continously increasing coming together with the trend for further integration of antennas and passives into the package. The higher the frequency, the more package and the printed circuit boad (PCB) play a decisive role on the overall system performance since the package properties and limitations have to be taken into account. Designing chip, package and board separately on their specific levels and combining them later is often insufficent because some high-frequency effects cannot be associated to only one of these levels. Hence, chip-package-board co-design methodologies are becoming more important. During such a co-design, the layout features of SIP and PCB have to be carefully modelled and simulated. In what follows, we investigate the co-simulation of highly integrated RF systems by means of electromagnetic (EM) modelling. We investigate various effects of chip-package-board co-design and demonstrate the feasibility of our co-simulation and approach by way of some examples for transceivers of E-and V-band communication and radar applications at 77 GHz.