- WAMI2017 Program Book
- General Chair Message
- 1st Keynote Speaker: The impact of Silicon as an emerging technology for 5G Circuits and System Solutions
- 2nd Keynote Speaker: PA Design for Future Wireless Systems
- Rudolf Henning Distinguished Mentoring Award
- Panel Session: The Push and Pull of Technology Solutions for 5G
As General Chair, I invite you to participate in the 2017 IEEE MTT-S Wireless and Microwave Technology Conference we affectionately call WAMICON. WAMICON will be held off the Atlantic Ocean in Cocoa Beach Florida Monday April 24th through Tuesday April 25th 2017. This will be the 18th consecutive Wireless and Microwave Conference held in Florida. WAMICON started life as an outcome of industry-academic exchange between the University of South Florida (USF) Electrical Engineering Department's Center for Wireless and Microwave Information Systems (WAMI Center) and companies involved in microwave and wireless engineering.
The first "conference" was held in February 1999 at the Embassy Suites adjacent to the USF campus. That conference with its small 50, or so, attendees has blossomed over the years into an IEEE MTT-S sponsored annual international conference earning generous support from academia and industry. What started from the "friends and family of USF" has grown to a worldwide network of industry and academia now the "Friends and family of WAMICON". Learn more »
The impact of Silicon as an emerging technology for 5G Circuits and System Solutions
Abstract: Every major electronic product
innovation or improvement in capability is ushered in on a
foundation of other technological innovations many of which have
been percolating over several years. 5G network capabilities and
its benefits are no exception. Given the past expense of
millimeter and microwave technologies and products many
improvements in semiconductor technology, manufacturing and
design are needed to reach the economy of scale needed for 5G.
This talk will elaborate on the improvements and impact that
silicon will have as an emerging technology for millimeter and microwave design and systems for 5G.
Biography Paul Colestock is the founding director and currently head of the Exploratory Design Group at GLOBALFOUNDRIES focused on pathfinding approaches to digital, analog, RF and millimeter wave IC design in their respective leading edge technologies. Previously he served as the head of Segment Marketing and applications at GLOBALFOUNDRIES, most recently as its Senior Director for Strategic Product Planning. The responsibility of Mr. Colestock is to effectively strategize, plan, develop and monetize vertical market centric products, design techniques, IP and technologies. He has extensive semiconductor related experience with over 25 years of semiconductor product design, verification, manufacturing, management and marketing. He has held leadership positions across the semiconductor ecosystem including GLOBALFOUNDRIES, Agilent Technologies, Cadence Design Systems, Jazz Semiconductor, Silvaco International and semiconductor startups Hesson Labs and Napali Technologies. Mr. Colestock also served six years in the U.S. Navy. Mr. Colestock also serves as an advisor for Silicon Catalyst, an early stage hardware incubator in Silicon Valley. Mr. Colestock received a BS/MSEE in Electrical Engineering from the University of South Florida and was a PhD candidate at the University of Texas Austin. His areas of Expertise include:
- Design and technology co-optimization of Digital, Analog, RF and mmWave circuits
- Yield and manufacturability of Analog, RF and mmWave circuits
- Computational modeling of high frequency circuits and technologies
- Managing for innovation and intellectual property development
- Commercialization of early stage technology research
- Lean Startups
PA Design for Future Wireless Systems
Abstract: This paper presents an overview of efficiency enhancement techniques for microwave power
amplifiers (PAs) through supply modulation. The focus is on next-generation wireless systems, which are predicted to operate at higher carrier frequencies, with
significantly larger signal bandwidths and under conditions that require more functionality and flexibility at the RF front end.
Several PAs with supply modulation are presented to illustrate the challenges and propose some solutions. Starting from
continuous envelope tracking of a 10-W X-band MMIC GaN PAs with up to 40-MHz signal bandwidth with >40% composite
efficiency (CPAE), the approach is extended to signals with bandwidths >100MHz and with PAPR>11dB using slew-rate
reduction methods. Further extensions to supply modulation for multiple simultaneous signals, each with a bandwidth of a few
tens of MHz, randomly positioned over a 1-GHz band are shown. Supply modulation is also demonstrated to improve efficiency
for more complex PA architectures, such as a 10-GHz Chireix outphasing MMIC PA and a 2-GHz linear and efficient
harmonically-injected PA. The flexibility of supply modulation is discussed for PAs that can efficiently amplify both
communications and radar signals with improved performance. Learn more »
Biography Zoya Popovic received her Dipl. Ing. degree from the University of Belgrade, Serbia, in 1985, and the M.S. and Ph.D. degrees from Caltech, Pasadena, California, in 1986 and 1990, respectively. Her doctoral thesis was on large-scale quasi-optical microwave power combining. She joined the faculty of the University of Colorado in Boulder in August 1990, where she became a full professor in 1998, and received an endowed professorship in 2006. She has developed five undergraduate and graduate electromagnetics and microwave laboratory courses and co-authored (with her late father) Introductory Electromagnetics for the junior-level core course for electrical and computer engineering students, translated to several foreign languages. Her research interests include high-efficiency linear microwave power amplifiers, low-loss broadband microwave and millimeter-wave circuits, millimeter-wave and THz quasi-optical techniques, intelligent RF circuits, active antenna arrays, voltage standards, near field electromagnetic probing, and wireless powering for low-power sensors. She was a Visiting Professor at the Technische Universitat Muenchen, Munich, Germany, in 2001 and 2003. Dr. Popovic is currently Distinguished Professor Hudson Moore Jr. Endowed Chair of the Department of Electrical, Computer and Energy Engineering at the University of Colorado, Boulder
Nominations for the 2017 award are due February 1, 2017
Submit nomination form to Tom Weller,
Description: To recognize an individual who has performed exemplary service encouraging students and/or
mentoring young engineers to advance their careers in the areas of RF/Microwave and/or Wireless Engineering.
Eligibility and Judging: The selected person will be a current or past member of IEEE who has had a strong impact on influencing students, young engineers or young faculty members to further their professional careers in the areas of RF/Microwave and/or Wireless Engineering. Factors to be considered are leadership, innovation, dedication, distinguished service and breadth of participation. Eligibility and Selection process shall comply with procedures and regulations established in IEEE and Society governing documents, in particular with IEEE Policy 4.4 on Award Limitations. http://www.ieee.org/web/aboutus/whatis/policies/p4-4.html
Presentation: Presented at the annual IEEE WAMICON conference or alternate Florida IEEE event.
Sponsorship: Sponsorship by the IEEE Florida West Coast MTT/AP/ED Chapter and the IEEE Florida West Coast Section.
Selection: Awards Committee as a subset of the annual IEEE WAMICON Conference Steering Committee in cooperation with the IEEE Florida West Coast Section Awards Committee.
The Push and Pull of Technology Solutions for 5G
The development of technology solutions for 5G communications are already well underway in parallel with development of the standard. 5G promises unprecedented high speed mobile and wireless data rates and utilization of frequencies into the mm-wave spectrum. 5G represents a strong, yet still not completely defined, market pull for new and cost effective technology solutions. This pull is driving advances in semiconductors, circuit design, test and simulation, heterogenous integration and packaging. Various commercial interests no doubt have incentive to push their own specific technology solutions to be adopted as this new market unfolds. This panel will allow speakers to present their vision for 5G Technology evolution and discuss their perspective on the push and pull of the solutions required to realize the promise of 5G for practical applications.
- Dr. Larry Dunleavy , Modelithics Inc.
- Michael P. Hallman, Microwave Journal
- Vincent Pelliccia, VP of Business Development, Anokiwave
- Paul Colestock, Ph.D., Founding Director, Head of Exploratory Design Group, GlobalFoundries
- Moray Rumney, Lead Technologist, Keysight Technologies
- Takao Inoue, Ph.D., Wireless Solutions Architect, AWR Group, National Instruments
- Bror Peterson, Principle Systems Engineer, Infrastructure and Defense Products, Qorvo
Vincent Pelliccia, VP of Business Development, Anokiwave
Vincent E. Pelliccia joined Anokiwave in March 2016 as a Vice President, Business Development. Vincent comes to Anokiwave from M/A-COM where he served in multiple roles including Senior Director Asia Pacific Sales as an ExPat in Hong Kong. He has 30 years of industry experience starting with E-Systems designing Null Steered Phased Arrays and then at M/A-COM working on Ku Band VSAT and LMDS Systems. He helped Mimix Broadband build out Sales Channels as Vice President North American Sales selling Point to Point and mmWave components and then joined M/A-COM through merger.
Paul Colestock, Ph.D., Founding Director, Head of Exploratory Design Group, GLOBALFOUNDRIES
Paul Colestock is the founding director and currently head of the Exploratory Design Group at GLOBALFOUNDRIES focused on path finding approaches to digital, analog, RF and millimeter wave IC design in their respective leading edge technologies. Previously he served as the head of Segment Marketing and applications at GLOBALFOUNDRIES, most recently as its Senior Director for Strategic Product Planning. The responsibility of Mr. Colestock is to effectively strategize, plan, develop and monetize vertical market centric products, design techniques, IP and technologies. He has extensive semiconductor related experience with over 25 years of semiconductor product design, verification, manufacturing, management and marketing. He has held leadership positions across the semiconductor ecosystem including GLOBALFOUNDRIES, Agilent Technologies, Cadence Design Systems, Jazz Semiconductor, Silvaco International and semiconductor startups Hesson Labs and Napali Technologies. Mr. Colestock also served six years in the U.S. Navy. Mr. Colestock also serves as an advisor for Silicon Catalyst, an early stage hardware incubator in Silicon Valley. Mr. Colestock received a BS/MSEE in Electrical Engineering from the University of South Florida and was a PhD candidate at the University of Texas Austin.
Moray Rumney, Lead Technologist, Keysight Technologies
Moray Rumney joined Hewlett-Packard in 1984 after completing a B.Sc. in Electronics from Edinburgh's Heriot-Watt University. The HP electronic test and measurement business was split off to Agilent Technologies in 1999 and most recently in August 2014 to Keysight Technologies. Moray's main work has been the development and system design of base station emulators used in the development and testing of cellular phones. Moray joined ETSI in 1991 and 3GPP in 1999, where he was a significant contributor to the development of type approval tests for GSM and UMTS. He currently represents Keysight at 3GPP RAN WG4, where the air interfaces for HSPA+, LTE Advanced and the new 5G radio are being developed. Moray's current focus is in radiated over-the-air (OTA) test methods. Moray has published many technical articles in the field of cellular communications and is a regular speaker at industry conferences. He was editor and the major contributing author to Agilent's book LTE and the Evolution to 4G Wireless whose second edition was published in 2013.
Takao Inoue, Ph.D., Wireless Solutions Architect, AWR Group, National Instruments
Takao Inoue received his B.S.E.E. and M.S.E.E. degrees from Oregon State University and the Ph.D. from the University of Texas at Austin. Currently, he is with AWR Group R&D at National Instruments leading the development of 5G related products for VSS. He has been a 3GPP RAN1 and RAN4 delegate since 2010. He is a co-vice chair of MTT 20 wireless communication technical committee and also serves on COMSOC signal processing and communications electronics technical committee.
Bror Peterson, Principle Systems Engineer, Infrastructure and Defense Products, Qorvo
Bror Peterson is a principle systems engineer with Qorvo Inc. located in Richardson Texas. He is currently focused on mmWave 5G base-station RF system analysis and product development. He received a Master of Science in Electrical Engineering degree from Virginia Tech in 2000. He has been involved with research, design, and development of wireless infrastructure systems for over 17 years with a broad background in communications theory and systems analysis.